Multi Layer Turnkey PCB Assembly / Prototype Printed Circuit Boards Assembly HSPCBA1001 manufacturer from China Huaswin Electronics Co.,Limited

Multi Layer Turnkey PCB Assembly / Prototype Printed Circuit Boards Assembly

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: HSPCBA1001

Multi Layer Turnkey PCB Assembly / Prototype Printed Circuit Boards Assembly

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Multi Layer Turnkey PCB Assembly / Prototype Printed Circuit Boards Assembly

Specifications

1. Electronics PCB and PCB assembly manufacturer
2. UL,RoHS,SGS, ISO Approved
3. Reliable OEM / ODM PCB assembly
4. High Quality, fast delivery

Huaswin Electronics offers customer two options when it comes to PCB Assembly Services, Full or Partial

Turn-Key PCB Assembly service.

Full Turn-Key service takes care of the entire process including PCB Fabrication, Component Procurement,

PCB Assembly and testing. For customers who do not require the full Turn-Key solution then Partial Turn-Key

will fit the bill.

With Partial Turn-Key, you provide the blank PCBs and we assemble according to your requirements. You have

the option of providing some or all of the components, and Huaswin’s dedicated Procurement team will assist

with any remaining parts.

Welcome to Huaswin!

Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.

We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP

assembly ,IC pre-programming / burning on-line, testing, packing.

PCB capability and services:

1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test

Detailed Specification of PCB Manufacturing

1	layer	1-30 layer
2	Material	CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
3	Board thickness	0.2mm-6mm
4	Max.finished board size	800*508mm
5	Min.drilled hole size	0.25mm
6	min.line width	0.075mm(3mil)
7	min.line spacing	0.075mm(3mil)
8	Surface finish	HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,TS16949
15	Profiling punching	Routing,V-CUT,Beveling

PCB Assembly services:

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

When coated, it is clearly visible as a clear and shiny material.

Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material

Testing Methods

AOI Testing
·Checks for solder paste
·Checks for components down to 0201"
·Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
·BGAs
·Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

Detailed Specification of Pcb Assembly

Type of Assembly

SMT and Thru-hole